Minimizing Thermal Imbalance of RC-IGBT by Bonding Technology
نویسندگان
چکیده
منابع مشابه
suppression of coke formation in thermal cracking by coke inhibitors
the main purpose of this research was to:1.develop a coking model for thermal cracking of naphtha.2.study coke inhibition methods using different coke inhibitors.developing a coking model in naphtha cracking reactors requires a suitable model of the thermal cracking reactor based on a reliable kinetic model.to obtain reliable results all these models shall be solved simultaneously.for this pu...
15 صفحه اولThermal response of nonequilibrium RC circuits.
We analyze experimental data obtained from an electrical circuit having components at different temperatures, showing how to predict its response to temperature variations. This illustrates in detail how to utilize a recent linear response theory for nonequilibrium overdamped stochastic systems. To validate these results, we introduce a reweighting procedure that mimics the actual realization o...
متن کاملComposite Laser Ceramics by Advanced Bonding Technology
Composites obtained by bonding materials with the same crystal structure and different chemical compositions can create new functions that do not exist in conventional concepts. We have succeeded in bonding polycrystalline YAG and Nd:YAG ceramics without any interstices at the bonding interface, and the bonding state of this composite was at the atomic level, similar to the grain boundary struc...
متن کاملLoss Characteristics of 6.5 kV RC-IGBT Applied to a Traction Converter
6.5 kV level IGBT (Insulated Gate Bipolar Transistor) modules are widely applied in megawatt locomotive (MCUs) traction converters, to achieve an upper 3.5 kV DC link, which is beneficial for decreasing power losses and increasing the power density. Reverse Conducting IGBT (RC-IGBT) constructs the conventional IGBT function and freewheel diode function in a single chip, which has a greater flow...
متن کاملFormation of Embedded Microstructures by Thermal Activated Solvent Bonding
We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bon...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEJ journal of industry applications
سال: 2022
ISSN: ['2187-1094', '2187-1108']
DOI: https://doi.org/10.1541/ieejjia.21014496